Excimer laser machining by a multiple imaging system using holographic optical elements

Tomohiro Sasagawa; Tatsuya Yamamoto; Mitsuo Inoue; Masaaki Tanaka; Shigenori Yagi

Conference on Lasers and Electro-Optics
OSA Technical Digest (Optica Publishing Group, 1996),
paper CThH3

Excimer laser machining by a multiple imaging system using holographic optical elements

Tomohiro Sasagawa, Tatsuya Yamamoto, Mitsuo Inoue, Masaaki Tanaka, and Shigenori Yagi

Conference on Lasers and Electro-Optics 1996

Anaheim, California United States
2–7 June 1996
ISBN: 1-55752-443-2

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Laser Micromachining (CThH)

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T. Sasagawa, T. Yamamoto, M. Inoue, M. Tanaka, and S. Yagi, "Excimer laser machining by a multiple imaging system using holographic optical elements," in Conference on Lasers and Electro-Optics, J. Bowers, D. Miller, D. Scifres, and A. Weiner, eds., Vol. 9 of OSA Technical Digest (Optica Publishing Group, 1996), paper CThH3.

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Abstract

Mask-projection systems are widely used in excimer laser machining such as viahole drilling for printed circuit boards. However, a large part of the laser-beam power is lost on the mask, because the open areas of masks are ordinarily very small. A more efficient method is machining with holograms. CO₂ or Nd:YAG laser machining with holograms that directly generate patterns has been reported since the 1970s.^1-3 For excimer lasers, because of their low spatial coherence, it is difficult to generate patterns directly with holograms.

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