Wafer fusion technology for optoelectronic devices

John Bowers; Aaron Hawkins; Near Margalit; Patrick Abraham; Alexis Black; Archie Holmes; Evelyn Hu

Conference on Lasers and Electro-Optics
OSA Technical Digest (Optica Publishing Group, 1997),
paper CThA1

Wafer fusion technology for optoelectronic devices

John Bowers, Aaron Hawkins, Near Margalit, Patrick Abraham, Alexis Black, Archie Holmes, and Evelyn Hu

Conference on Lasers and Electro-Optics 1997

Baltimore, Maryland United States
18–23 May 1997
ISBN: 1-55752-498-8

From the session
Novel Semiconductor Laser Devices and Materials (CThA)

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J. Bowers, A. Hawkins, N. Margalit, P. Abraham, A. Black, A. Holmes, and E. Hu, "Wafer fusion technology for optoelectronic devices," in Conference on Lasers and Electro-Optics, D. Killinger, G. Valley, C. Chang-Hasnain, and W. Knox, eds., Vol. 11 of OSA Technical Digest (Optica Publishing Group, 1997), paper CThA1.

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Abstract

Wafer fusion allows novel devices to be made that use combinations of materials that are not lattice matched and are thicker than the conventional limit for dislocation formation.

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