Abstract

Polyimide and Teflon are of great interest to the electronic industry due to dielectric strength, chemical resistance and temperature stability. Extensive work was devoted in the past to the laser ablation of polyimide using ultraviolet radiation and also infra-red radiation.^1,2 In the case of Teflon, laser absorbing materials were imbedded to achieve ablation.³ Here, we are introducing a novel technique using visible laser (515 nm argon ion laser) in millisecond range pulses to drill both polyimide and reinforced Teflon with SiO₂ particles. We named our technique LAser Ultrasonic Drilling (LAUD) as a short ultrasonic cleaning is needed after the drilling.

© 1995 IEEE