Abstract

Many researches have been done in the field of free-space optical interconnection due to the inherent parallelism and large bandwidth of optics. Packaged planar optical system seems to be promising to realize the rigid and compact interconnection modules for inter and intra-multichip module interconnections.^1,2 However, stringent alignment accuracy requirement may lead to a complicated packaging process.³ In this report, we present that the alignment accuracy requirement can be reduced by using the focused Gaussian beams compared with the one-to-one imaging.

© 1995 IEEE