Characterization of microdefects and microroughness in silicon wafers by a Rayleigh-Brillouin scattering spectrometer

Lu Taijing; S. C. Ng

The Pacific Rim Conference on Lasers and Electro-Optics
Technical Digest Series (Optica Publishing Group, 1995),
paper ThH3

Characterization of microdefects and microroughness in silicon wafers by a Rayleigh-Brillouin scattering spectrometer

Lu Taijing and S. C. Ng

Conference on Lasers and Electro-Optics/Pacific Rim 1995

Chiba Japan
10–14 July 1995
ISBN:

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Laser Chemistry Materials Processing and Industrial Applications I (ThH)

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L. Taijing and S. C. Ng, "Characterization of microdefects and microroughness in silicon wafers by a Rayleigh-Brillouin scattering spectrometer," in The Pacific Rim Conference on Lasers and Electro-Optics, Technical Digest Series (Optica Publishing Group, 1995), paper ThH3.

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Abstract

It is well known that the development and implementation of an effective non-destructive microdefect and surface microroughness characterization system is essential for the progress of the science and technology in advanced materials used for ULSI fabrication.

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