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Conferences > CLEOPR > 2022 > P_CTh1 > P_CTh1_07

Evaluation of Thermal Resistance of Direct-Bonded Yb:YAG Ceramic

Yasuhiro Kamba, Chen Qu, Taisuke Miura, Miyuki Uomoto, and Takehito Shimatsu

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Abstract

We report a measurement of thermal resistance between Yb:YAG and aluminum plate contacted via atomic diffusion bonding (ADB). The thermal resistance of Yb:YAG/Al layer via ADB was 3 times lower than that via indium foil.

© 2022 IEEE

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