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Conferences > CLEO_AT > 2019 > ATu3I > ATu3I.7

Efficient ablation of silicon with high power GHz femtosecond laser source

E. Mottay, G. Bonamis, K. Mishchik, J. Lopez, E. Audouard, C. Hönninger, and I. Manek-Hönninger

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Abstract

Ablation of silicon using high power GHz femtosecond lasers achieves specific removal rate of 2.5 mm3/min/W. Ablation morphologies are discussed in terms of thermal and non-thermal mechanisms

© 2019 The Author(s)

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