Abstract
Providing free-space optical interconnects and the integration of a 2-D optoelectronic interfaces with silicon chips (smart-pixels) can allow many advantages over convention interconnects. However, the introduction of free-space optics brings new technological difficulties for the system designer, mainly concerned with the system packaging. Active alignment is an important design option to achieve realistic low-cost free-space optical interconnects [1].
© 1998 IEEE
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