Abstract
Vertical-cavity surface emitting lasers (VCSEL's) are promising light sources for optical computing and interconnection due to their unique topology and two-dimensional array capacity. To date, VCSEL's with monolithic distributed Bragg reflectors (DBR's) require current injection through the upper p- type DBR resulting in a large threshold voltage due to the concomitant series resistance. The voltage drop in the p-type DBR also leads to additional thermal effects which degrade the VCSEL performance.1 Various methods, such as introducing extra layers with intermediate composition into the quarterwave DBR2 or tapered doping in the p-type DBR,3 have provided a reduction in the series resistance, but have lead to complicated DBR designs. We have developed a novel VCSEL structure, utilizing dry etching, in situ metallization, and ion implantation, which can avoid current injection through the upper DBR, and thus simplifies the required epilayers.
© 1992 Optical Society of America
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