Abstract
High-precision packaging of optoelectronic (OE) components is a laborintensive and expensive process. We believe that the pigtailing process must be automated to realize a significant reduction in the cost of QE packages. We are addressing issues of automating the fiber pigtailing process on silicon waferboards or microbenches. While we are initially concentrating on laser diodes, the same techniques are applicable to other QE devices. This paper focuses on reflowing solders for the attachment of OE components on silicon microbenches. Nearly ten years ago, miniature metallic heaters to reflow solder for the attachment of OE components on ceramic waferboards were developed [1]. We have recently developed miniature polysilicon heaters which are compatible with silicon microbenches [2]. These miniature heaters avoid the problem of raising the entire microbench to the solder melting point to attach components. Most importantly, these miniature heaters are completely compatible with automating the attachment process.
© 1996 Optical Society of America
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