Compact integrated 100 Gb/s optical modulators using hybrid assembly technique with silica-based PLCs and LiNbO3 devices

Akimasa Kaneko; Hiroshi Yamazaki; Takashi Yamada

doi:10.1364/OFC.2009.OThN3

Optical Fiber Communication Conference and National Fiber Optic Engineers Conference
OSA Technical Digest (CD) (Optica Publishing Group, 2009),
paper OThN3
•https://doi.org/10.1364/OFC.2009.OThN3

Compact integrated 100 Gb/s optical modulators using hybrid assembly technique with silica-based PLCs and LiNbO₃ devices

Akimasa Kaneko, Hiroshi Yamazaki, and Takashi Yamada

Optical Fiber Communication Conference 2009

San Diego, California United States
22–26 March 2009
ISBN: 978-1-55752-865-0

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Integrated Photonic Devices and Packaging (OThN)

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A. Kaneko, H. Yamazaki, and T. Yamada, "Compact integrated 100 Gb/s optical modulators using hybrid assembly technique with silica-based PLCs and LiNbO3 devices," in Optical Fiber Communication Conference and National Fiber Optic Engineers Conference, OSA Technical Digest (CD) (Optica Publishing Group, 2009), paper OThN3.

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Abstract

We have developed compact integrated 100 Gb/s optical modulators by using arrayed optical phase modulators with an LN waveguide and two PLCs with various passive waveguides. These modulators exhibited excellent performance.

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