A 200Gb/s Low Power DSP-Based Optical Receiver and Transmitter with Integrated TIA and Laser Drivers

A. Zafrany; D. Burgos; L. Cai; S. Chong; C. Cramm; S. Dadash; V. Giridharan; V. Gurumoorthy; B. Helal; C. Ho; A. Iyer; S. Jantzi; C. Loi; T. Nguyen; K. Parker; E. Pillai; K. Raviprakash; S. Ray; P. Rossi; Z. Sun; A. Tan; L. Tse; B. Wall; L. Wang; J. Wang; T. Wu

doi:10.1364/OFC.2023.W2A.2

Optical Fiber Communication Conference (OFC) 2023
Technical Digest Series (Optica Publishing Group, 2023),
paper W2A.2
•https://doi.org/10.1364/OFC.2023.W2A.2

A 200Gb/s Low Power DSP-Based Optical Receiver and Transmitter with Integrated TIA and Laser Drivers

A. Zafrany, D. Burgos, L. Cai, S. Chong, C. Cramm, S. Dadash, V. Giridharan, V. Gurumoorthy, B. Helal, C. Ho, A. Iyer, S. Jantzi, C. Loi, T. Nguyen, K. Parker, E. Pillai, K. Raviprakash, S. Ray, P. Rossi, Z. Sun, A. Tan, L. Tse, B. Wall, L. Wang, J. Wang, and T. Wu

Optical Fiber Communication Conference 2023

San Diego California United States
5–9 March 2023
ISBN: 978-1-957171-18-0

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Posters Session I, In-Person (W2A)

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A. Zafrany, D. Burgos, L. Cai, S. Chong, C. Cramm, S. Dadash, V. Giridharan, V. Gurumoorthy, B. Helal, C. Ho, A. Iyer, S. Jantzi, C. Loi, T. Nguyen, K. Parker, E. Pillai, K. Raviprakash, S. Ray, P. Rossi, Z. Sun, A. Tan, L. Tse, B. Wall, L. Wang, J. Wang, and T. Wu, "A 200Gb/s Low Power DSP-Based Optical Receiver and Transmitter with Integrated TIA and Laser Drivers," in Optical Fiber Communication Conference (OFC) 2023, Technical Digest Series (Optica Publishing Group, 2023), paper W2A.2.

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Abstract

Fully integrated low power 200Gb/s DSP based optical transmitter and receiver ICs with transmitter chip incorporating fully integrated laser drivers and receiver chip with fully integrated Transimpedance amplifier (TIA) in 16nm FinFet using wirebond technology.

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