Abstract
A model to describe removal rates during silicon dioxide polishing has been developed and validated. The model includes submodels for the bulk pad behavior, the behavior of pad asperities, and the pad-wafer relative velocity.
© 2004 Optical Society of America
PDF ArticleMore Like This
Baruch A. Fuchs
TuAA5 Optical Fabrication and Testing (OF&T) 1987
G. A. Keeler, D. K. Serkland, K. M. Geib, G. M. Peake, and A. Mar
CTuC6 Conference on Lasers and Electro-Optics (CLEO:S&I) 2004
Chr. Gimkiewicz, Chr. Zschokke, S. Obi, C. Urban, J. S. Pedersen, M. T. Gale, and M. Moser
MF52 Optical Fiber Communication Conference (OFC) 2004