Abstract

Optical backplanes are of increasing interest for commercial and military avionics processors. For such systems that competes on the basis of throughput per unit volume (and/or weight), increased component counts dictates a move from conventional packaging and board assembly technology to chip-on-board or multichip module (MCM) technologies as clock speeds and number of I/Os increase, and greater functionality are being demanded in a given system. Optical interconnects is likely to find its first introduction in such systems where practical density limits are being reached. Such situations include the maximum pin numbers in a manufacturable board-to-backplane connectors, or the maximum number of I/Os can be provided in an MCM.

© 1995 Optical Society of America