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Estimation of Subsurface Damage Depth by Dimpling

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Abstract

Sample Preparation- To test each of the methods of measuring subsurface damage, three fused silica samples were used. Two of the samples were one inch in diameter and one inch thick. These were ground using resin bonded diamond pellets bonded to a metal plate using a conventional Strasbaugh grinding machine. Both 12 and 30 micron diamond pellets were used. These were then diamond generated to approximately 1 mm thickness from the back. The back was then ground and polished using conventional techniques. The other sample began as a 1"X3" fused silica microscope slide that was generated on a swing arm generator with a 320-grit resin bonded diamond cup wheel.

© 1990 Optical Society of America

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