Whole-Field Laser Doppler Multi-Beam Differential Vibration Sensor Based on High-Speed CMOS Camera for Buried Objects Detection

V. Aranchuk; B. Zhang; I. Aranchuk; C. Hickey

doi:10.1364/SENSORS.2023.SM3B.2

Optica Sensing Congress 2023 (AIS, FTS, HISE, Sensors, ES)
Technical Digest Series (Optica Publishing Group, 2023),
paper SM3B.2
•https://doi.org/10.1364/SENSORS.2023.SM3B.2

Whole-Field Laser Doppler Multi-Beam Differential Vibration Sensor Based on High-Speed CMOS Camera for Buried Objects Detection

V. Aranchuk, B. Zhang, I. Aranchuk, and C. Hickey

Optical Sensors 2023

Munich Germany
30 July–3 August 2023
ISBN: 978-1-957171-24-1

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Laser Sensing I (SM3B)

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V. Aranchuk, B. Zhang, I. Aranchuk, and C. Hickey, "Whole-Field Laser Doppler Multi-Beam Differential Vibration Sensor Based on High-Speed CMOS Camera for Buried Objects Detection," in Optica Sensing Congress 2023 (AIS, FTS, HISE, Sensors, ES), Technical Digest Series (Optica Publishing Group, 2023), paper SM3B.2.

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Abstract

A Laser Doppler 2D-array multi-beam differential vibration sensor based on a high-speed CMOS camera that measures velocity difference between points on the object has been developed. Application of the sensor for detection of buried objects has been demonstrated.

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