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Design of hybrid micro-diffractive-refractive optical element with wide field of view for free space optical interconnections: errata

Yongqi Fu and Ngoi Kok Ann Bryan

Open Access Open Access

Abstract

Substrate thickness of InP and GaAs, and dimension of photodetector in Fig. 1 were incorrect.

©2002 Optical Society of America

Substrate thickness of InP and GaAs, and dimension of photodetector should be 350 μm, and 70 μm × 70 μm, respectively, as shown below in Fig.1.

 figure: Fig.1

Fig.1 Schematic of free space interconnection packaging architecture for 8×8 VCSEL array and InGaAs/InP photodetector array. AuSn solder bumps act as both connecting two submounts and ensure working distance (L, which depends on operating wavelength and diameter of beam waist) of the integrated lenses.

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References and links

1. Yongqi Fu and Ngoi Kok Ann Bryan, “Design of hybrid micro-diffractive-refractive optical element with wide field of view for free space optical interconnections,” Opt. Express 10, 540–549 (2002), http://www.opticsexpress.org/abstract.cfm?URI=OPEX-10-13-540. [CrossRef]   [PubMed]  

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Figures (1)
Fig.1
Fig.1 Schematic of free space interconnection packaging architecture for 8×8 VCSEL array and InGaAs/InP photodetector array. AuSn solder bumps act as both connecting two submounts and ensure working distance (L, which depends on operating wavelength and diameter of beam waist) of the integrated lenses.

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