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Conferences > ACPC > 2021 > T4A > T4A.228

Thermal Analysis and Hybrid Packaging Design of SOI Based All Optical Signal Processing Chip

Kunpeng Zhai, Ya Jin, Yinfang Chen, Shaokang Chen, Xin Wang, Huashun Wen, and Ninghua Zhu

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Abstract

The thermal analysis of silicon based all-optical processing chip and a novel packaging structure are reported. We simulated thermal crosstalk between the waveguides, then manufactured packaging structure to make the chip work at room temperature.

© 2021 The Author(s)

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