Silicon photonics is the key to realize higher-bandwidth interconnect with less power consumption and a smaller footprint for the future computer system. When we use silicon photonic chips with the processor, the chips have to be packaged like the today’s processor module. We evaluated packaging design options photonics chips with processors for achieving fan-out of the optical signal lines, maintaining mechanical robustness, and signal connection to the external signal paths like the conventional packaging.
© 2010 Optical Society of AmericaPDF Article
More Like This
SM2O.1 CLEO: Science and Innovations (CLEO_SI) 2020
Qing Zhao, Xiaolu Song, Zhen Dong, Lei Gao, Ruiqiang Ji, Yanbo Li, Ling Hao, Shengmeng Fu, and Li Zeng
AF4F.4 Asia Communications and Photonics Conference (ACPC) 2016
Nikolai N. Klimov, Thomas Purdy, and Zeeshan Ahmed
AW1J.6 CLEO: Applications and Technology (CLEO_AT) 2016