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Conferences > CLEO > 1996 > CThC > CThC6
  • Conference on Lasers and Electro-Optics
  • OSA Technical Digest (Optica Publishing Group, 1996),
  • paper CThC6

Failure mechanisms in semiconductor laser packaging

J. C. Chen, W. T. Chen, S. T. Chang, J. S. Horng, H. H. Lin, M. J. Sun, W. H. Wang, and W. H. Cheng

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Abstract

Characteristics of failure mechanisms in laser welding technique for semiconductor laser packaging were investigated by metallographic microscopes. The results showed that both hole and crack failures in laser packaging can be eliminated. A direct metallographic observation found that the hole failure disappeared as the laser power density fell below 3 × 105 W/cm2. The stainless-to-kovar joints showed that the cracks can be avoided by partial or complete removal of the gold plating from the kovar before welding.

© 1996 Optical Society of America

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