Abstract
We present a flip-chip integration process in which the vertical alignment is guaranteed by a mechanical contact between pedestals defined in a recess etched into a silicon photonics chip and a laser or semiconductor optical amplifier. By selectively etching up to the active region of the III-V materials, we can make the accuracy of vertical alignment independent on the process control applied to layer thicknesses during silicon photonics or III-V chip fabrication, enabling alignment tolerances below ±10 nm in the vertical (Z-)direction.
© 2017 Optical Society of America
PDF ArticleMore Like This
Gunther Roelkens, Emanuel P. Haglund, Sulakshna Kumari, Erik Haglund, Johan S. Gustavsson, Roel Baets, and Anders Larsson
W3E.6 Optical Fiber Communication Conference (OFC) 2017
Tymon Barwicz, Yves Martin, Jae-Woong Nah, Swetha Kamlapurkar, Robert L. Bruce, Sebastian Engelmann, and Yurii A. Vlasov.
FF5F.3 Frontiers in Optics (FiO) 2016
Tymon Barwicz, Swetha Kamlapurkar, Yves Martin, Robert L. Bruce, and Sebastian Engelmann
Th2A.39 Optical Fiber Communication Conference (OFC) 2017