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Conferences > FiO > 2016 > FF5F > FF5F.3

Demonstration of Self-Aligned Flip-Chip Photonic Assembly with 1.1dB Loss and >120nm Bandwidth

Tymon Barwicz, Yves Martin, Jae-Woong Nah, Swetha Kamlapurkar, Robert L. Bruce, Sebastian Engelmann, and Yurii A. Vlasov.

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Abstract

We demonstrate direct flip-chip assembly of photonic dies with solder-induced self-alignment to sub-micron accuracy. We find a peak chip-to-chip transmission of -1.1 dB with 0.2 dB penalty over the 120 nm spectrum measured.

© 2016 Optical Society of America

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