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Demonstration of Self-Aligned Flip-Chip Photonic Assembly with 1.1dB Loss and >120nm Bandwidth

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Abstract

We demonstrate direct flip-chip assembly of photonic dies with solder-induced self-alignment to sub-micron accuracy. We find a peak chip-to-chip transmission of -1.1 dB with 0.2 dB penalty over the 120 nm spectrum measured.

© 2016 Optical Society of America

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