Demonstration of Self-Aligned Flip-Chip Photonic Assembly with 1.1dB Loss and &gt;120nm Bandwidth

Tymon Barwicz; Yves Martin; Jae-Woong Nah; Swetha Kamlapurkar; Robert L. Bruce; Sebastian Engelmann; Yurii A. Vlasov.

doi:10.1364/FIO.2016.FF5F.3

Frontiers in Optics 2016
OSA Technical Digest (online) (Optica Publishing Group, 2016),
paper FF5F.3
•https://doi.org/10.1364/FIO.2016.FF5F.3

Demonstration of Self-Aligned Flip-Chip Photonic Assembly with 1.1dB Loss and >120nm Bandwidth

Tymon Barwicz, Yves Martin, Jae-Woong Nah, Swetha Kamlapurkar, Robert L. Bruce, Sebastian Engelmann, and Yurii A. Vlasov.

Frontiers in Optics 2016

Rochester, New York United States
17–21 October 2016
ISBN: 978-1-943580-19-4

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Hybrid Integration (FF5F)

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T. Barwicz, Y. Martin, J. Nah, S. Kamlapurkar, R. L. Bruce, S. Engelmann, and Y. A. Vlasov., "Demonstration of Self-Aligned Flip-Chip Photonic Assembly with 1.1dB Loss and >120nm Bandwidth," in Frontiers in Optics 2016, OSA Technical Digest (online) (Optica Publishing Group, 2016), paper FF5F.3.

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Abstract

We demonstrate direct flip-chip assembly of photonic dies with solder-induced self-alignment to sub-micron accuracy. We find a peak chip-to-chip transmission of -1.1 dB with 0.2 dB penalty over the 120 nm spectrum measured.

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