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Conferences > CLEOPR > 2022 > P_CTh5 > P_CTh5_06

Deep Hole Drilling of Wide Bandgap Materials using Hybrid ArF Laser

Takashi Onose, Hironori Igarashi, Yasuhiro Kamba, Taisuke Miura, and Kouji Kakizaki

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Abstract

We demonstrated a laser drilling on sintered SiC plate using hybrid ArF laser at the wavelength of 193 nm. We obtained a diagonal hole on 2-mm thick SiC plate at a slant angle of 20°.

© 2022 IEEE

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