Expand this Topic clickable element to expand a topic
Skip to content
Optica Publishing Group
Conferences > CLEO_SI > 2023 > STh3H > STh3H.6

Vertically Stacked Passive Silicon Photonic Chiplet by µ-Transfer Printing

Rai Kou, Guangwei Cong, Noritsugu Yamamoto, Hitoshi Kawashima, Yuriko Maegami, Toshiya Murai, Tai Tsuchizawa, Akihiro Noriki, Takeru Amano, and Koji Yamada

Not Accessible

Your library or personal account may give you access

Abstract

We device double-layer stacked silicon photonic MMIs by µ-Transfer Printing. A 900×100-µm2-size chiplet consisting of a 220/60-nm-thick silicon core/slab structure is transferred twice onto thermal- and TEOS-SiO2 under-cladding layers.

© 2023 The Author(s)

PDF Article
Select as filters
Select Topics Cancel
Top
       
© Copyright 2024 | Optica Publishing Group. All rights reserved, including rights for text and data mining and training of artificial technologies or similar technologies.
Privacy | Terms of Use