Substrate-Independent Technique of III-V Heterogeneous Integration of Focal Plane Arrays and Lasers

Michael G. Wood; Matthew Bahr; Jordan E. Gutierrez; Evan M. Anderson; Patrick S. Finnegan; Scott E. Weatherred; William M. Martinez; Courtney L. Hummell; Robert Reyna; Shawn C. Arterburn; Tom A. Friedmann; Samuel D. Hawkins; Victor J. Patel; Alex T. Hendrickson; John F. Klem; Chris M. Long; Jonathon T. Olesberg; Joshua C. Shank; Daniel R. Chumney; Quinn M. Looker

doi:10.1364/CLEO_SI.2023.STh3H.5

CLEO 2023
Technical Digest Series (Optica Publishing Group, 2023),
paper STh3H.5
•https://doi.org/10.1364/CLEO_SI.2023.STh3H.5

Substrate-Independent Technique of III-V Heterogeneous Integration of Focal Plane Arrays and Lasers

Michael G. Wood, Matthew Bahr, Jordan E. Gutierrez, Evan M. Anderson, Patrick S. Finnegan, Scott E. Weatherred, William M. Martinez, Courtney L. Hummell, Robert Reyna, Shawn C. Arterburn, Tom A. Friedmann, Samuel D. Hawkins, Victor J. Patel, Alex T. Hendrickson, John F. Klem, Chris M. Long, Jonathon T. Olesberg, Joshua C. Shank, Daniel R. Chumney, and Quinn M. Looker

CLEO: Science and Innovations 2023

San Jose, CA United States
7–12 May 2023
ISBN: 978-1-957171-25-8

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Heterogeneous Integration on Silicon (STh3H)

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M. G. Wood, M. Bahr, J. E. Gutierrez, E. M. Anderson, P. S. Finnegan, S. E. Weatherred, W. M. Martinez, C. L. Hummell, R. Reyna, S. C. Arterburn, T. A. Friedmann, S. D. Hawkins, V. J. Patel, A. T. Hendrickson, J. F. Klem, C. M. Long, J. T. Olesberg, J. C. Shank, D. R. Chumney, and Q. M. Looker, "Substrate-Independent Technique of III-V Heterogeneous Integration of Focal Plane Arrays and Lasers," in CLEO 2023, Technical Digest Series (Optica Publishing Group, 2023), paper STh3H.5.

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Abstract

We report on a two-step technique for post-bond III-V substrate removal involving precision mechanical milling and selective chemical etching. We show results on GaAs, GaSb, InP, and InAs substrates and from mm-scale chips to wafers.

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