Simultaneous Figuring and Finish of Glass and Semiconductor Materials Using Femtosecond Lasers

Jie Qiao

doi:10.1364/LAC.2022.LM2B.2

Optica Advanced Photonics Congress 2022
Technical Digest Series (Optica Publishing Group, 2022),
paper LM2B.2
•https://doi.org/10.1364/LAC.2022.LM2B.2

Simultaneous Figuring and Finish of Glass and Semiconductor Materials Using Femtosecond Lasers

Jie Qiao

Laser Applications Conference 2022

Barcelona Spain
11–15 December 2022
ISBN: 978-1-957171-20-3

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Brittle Materials Processing I (LM2B)

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J. Qiao, "Simultaneous Figuring and Finish of Glass and Semiconductor Materials Using Femtosecond Lasers," in Optica Advanced Photonics Congress 2022, Technical Digest Series (Optica Publishing Group, 2022), paper LM2B.2.

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Abstract

We have demonstrated simultaneous figuring and surface polishing of glass and semiconductor substrates using a femtosecond laser. Deterministic material removal with nanometer precision was achieved while maintaining optical surface quality.

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