Modeling of 355nm UV Laser Microprocessing FCCL

Fei Zhang; Jun Duan; Xiaoyan Zeng

doi:10.1364/LTST.2012.MTh4A.25

International Photonics and Optoelectronics Meetings
OSA Technical Digest (online) (Optica Publishing Group, 2012),
paper MTh4A.25
•https://doi.org/10.1364/LTST.2012.MTh4A.25

Modeling of 355nm UV Laser Microprocessing FCCL

Fei Zhang, Jun Duan, and Xiaoyan Zeng

Laser and Tera-Hertz Science and Technology 2012

Wuhan China
1–2 November 2012
ISBN: 978-1-55752-960-2

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MP3 Poster Session (MTh4A)

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F. Zhang, J. Duan, and X. Zeng, "Modeling of 355nm UV Laser Microprocessing FCCL," in International Photonics and Optoelectronics Meetings, OSA Technical Digest (online) (Optica Publishing Group, 2012), paper MTh4A.25.

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Abstract

A finite element simulation of nanosecond pulsed 355nm UV laser etching FCCL (Flexible Copper Clad Laminate) was carried out, and the simulated results of both etching width and depth were close to the experimental results.

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