Abstract

We present a method for measuring the thickness (in μm) and index of refraction of the high index damage layer at the end of an optical connector by using a standard dual wavelength back reflection meter. Using this method, we have systematically studied the extent of the resulting damage layer from various final polish process steps by varying polishing film types, pressures, times, etc. Such information can enable connector manufacturers to achieve consistent “Hyper PC” return loss performance from non angled connectors as desired by some end users.

© 2005 Optical Society of America