A 16x16 Vertical Cavity Surface Emitting Laser Array Module for Optical Processing and Interconnect Applications

David Paananen; John Wasserbauer; Jeffrey Scott; Paul Brusenbach; David Lewis; George Simonis

doi:10.1364/OC.1997.PD.1

Optics in Computing
Technical Digest Series (Optica Publishing Group, 1997),
paper PD.1
•https://doi.org/10.1364/OC.1997.PD.1

A 16x16 Vertical Cavity Surface Emitting Laser Array Module for Optical Processing and Interconnect Applications

David Paananen, John Wasserbauer, Jeffrey Scott, Paul Brusenbach, David Lewis, and George Simonis

Optics in Computing 1997

Incline Village, Nevada United States
18–21 March 1997
ISBN:

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D. Paananen, J. Wasserbauer, J. Scott, P. Brusenbach, D. Lewis, and G. Simonis, "A 16x16 Vertical Cavity Surface Emitting Laser Array Module for Optical Processing and Interconnect Applications," in Optics in Computing, Technical Digest Series (Optica Publishing Group, 1997), paper PD.1.

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Abstract

A 16x16 Vertical Cavity Surface Emitting Laser Array Module for Optical Processing and Interconnect Applications, D. Paananen, J. Wasserbauer, J. Scott, P. Brusenbach and D. Lewis, Vixel Corporation, G. Simonis, Army Research Laboratory. We integrated 16x16 VCSEL arrays onto silicon driver circuits using In/Pb solder bump bonding. Each VCSEL is randomly accessed via the silicon circuit.

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