Abstract
We have flip-chip bonded a 16×16 array of 970nm VCSELs to a Silicon CMOS circuit. The device yield after bonding and packaging of the Optoelectronic-VLSI chip is approximately 96%. Individual VCSELs are capable of modulated by the circuit at IGbit/s. Parallel testing of 80VCSELs at IGbit/s per VCSEL is presented.
© 1999 Optical Society of America
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