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An Application Specific Interconnect Fabric (ASIF) for free-space global optical intra-chip interconnects

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Abstract

A new chip-scale interconnect architecture is introduced, in which a 3-D optoelectronic Application Specific Interconnection Fabric (ASIF) is coupled to a conventional Silicon integrated circuit to alleviate the performance-limiting aspects of global metal interconnects.

© 2003 Optical Society of America

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