Abstract
Monolithic arrays of AlGaAs lasers, GaAs OEICs (optoelectronic integrated circuits) and multimode optical fibers are becoming increasingly attractive for use in high-speed cost sensitive, short distance (<1 km) computer interconnections.1 However, for the technology to be pervasive, optoelectronic packaging, which today involves robotically aligned and assembled precision machined components, must be advanced, in favor of planar-processed packages, utilizing batch fabrication and assembly techniques, compatible with arrays of optoelectronic devices.
© 1992 Optical Society of America
PDF ArticleMore Like This
A. K. Ghosh and R. S. Beech
WV3 OSA Annual Meeting (FIO) 1992
Kenneth P. Jackson
WC.1 Optical Design for Photonics (ODP) 1993
Vijayanand Vusirikala, Peter J. S. Heim, Mario Dagenais, and C. Philip McClay
CTuW7 Conference on Lasers and Electro-Optics (CLEO:S&I) 1996