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Conferences > OFC > 2018 > Tu2A > Tu2A.4

In-line Optical Amplification for Silicon Photonics Platform by Flip-Chip Bonded InP-SOAs

T. Matsumoto, T. Kurahashi, R. Konoike, K. Tanizawa, K. Suzuki, A. Uetake, K. Takabayashi, K. Ikeda, H. Kawashima, S. Akiyama, and S. Sekiguchi

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Abstract

We review the hybrid-integration of an InP semiconductor optical amplifier on a silicon photonics chip, and our in-line SOA integration using precise flip-chip bonding technology. We demonstrate the loss-less operation of a 4x4 switch with a 4ch-SOA array.

© 2018 The Author(s)

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