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Conferences > OFC > 2023 > Th1A > Th1A.5

Self-aligned Fiber Attach on Monolithic Silicon Photonic Chips: Moisture Effect and Hermetic Seal

Zhuo-Jie (George) Wu, Ping-Chuan Wang, Seungman Choi, Patrick Justison, Martin Gall, Jae-Kyu Cho, Takako Hirokawa, Yusheng Bian, Thomas Houghton, Vaishnavi Karra, Dan Moy, Karen Nummy, Dave Riggs, Norman Robson, Ian Melville, and Ken Giewont

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Abstract

We report a study on moisture effect on optical performance of monolithic silicon photonics technologies featuring V-grooves for self-aligned fiber attach. Chip-level hermetic sealing was achieved by implementing moisture barrier for the fiber coupler.

© 2023 The Author(s)

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