Expand this Topic clickable element to expand a topic
Skip to content
Optica Publishing Group

Role of etching in measurement of subsurface damage by SEM and optical microscopy

Not Accessible

Your library or personal account may give you access

Abstract

Evaluation of the depth of subsurface damage (SSD) on ground glass surfaces can be performed using a taper polishing (1) or "dimpling" technique (2) to expose the glass below the surface to observation. However, accurate determination of the depth is dependent on the ability to microscopically detect cracks. An etchant is generally applied to the glass surface prior to dimpling to "open" cracks and improve their detection.

© 1994 Optical Society of America

PDF Article
More Like This
Subsurface Damage Measurements of Opticam-generated Infrared Materials

K.A. Cerqua-Richardson, S.L. Schmidt, and J. Vakiner
OMD5 Optical Fabrication and Testing (OF&T) 1994

Machine Vision System for Measuring Subsurface Damage

John E. Greivenkamp and Matthew T. Chang
WB13 Optical Fabrication and Testing (OF&T) 1992

Subsurface Damage: Comparison of Automated and Visual Measurements

Matthew T. Chang, John E. Greivenkamp, Arne Lindquist, and Tim M. Rich
OMD4 Optical Fabrication and Testing (OF&T) 1994

Select as filters


Select Topics Cancel
© Copyright 2024 | Optica Publishing Group. All rights reserved, including rights for text and data mining and training of artificial technologies or similar technologies.