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Conferences > OPTCOMP > 1995 > OMB > OMB2

A Two Layer Image Processing Architecture Incorporating Integrated Focal Plane Detectors and Through-Wafer Optical Interconnect

D. Scott Wills, Nan Marie Jokerst, Martin Brooke, and April Brown

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Abstract

This paper presents an extremely high density and lightweight image processing system being designed at Georgia Tech. The system consists of two layers. The upper layer includes a focal plane array of thin-film GaAs detectors that are integrated directly on top of an array of Si-based SIMD processors. The lower layer consists of an array of more powerful MIMD processors connected in a wormhole routed two dimensional mesh. The two layers are interconnected via though-wafer optical interconnects using integrated InGaAsP devices.

© 1995 Optical Society of America

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