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Comparison of Polishing with Cerium Oxide and Diamond

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Abstract

A series of 3cm diameter, BK-7 glass samples were ground down through a series of loose abrasives ending with 12µ aluminum oxide. Half of the samples were then polished using "Liquid 85" cerium oxide compound and pitch for various times. The balance of the samples were polished with 10µ diamond in an epoxy dot matrix and water containing 5% water soluble oil coolant. Identical pressures (about 0.3psi) and velocities (about eight inches per second) were used in both cases. This paper compares the polish obtained, the speed of polish and the apparent residual surface damage as exposed by hydrofluoric acid etching.

© 1984 Optical Society of America

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