Combined polishing process of a sapphire aspherical component based on temperature-controlled magnetorheological processing

Ye Tian; Ye Tian; Ye Tian; Ye Tian; Shuo Qiao; Shuangpeng Guo; Yunze Hou; Feng Shi; Feng Shi; Feng Shi

doi:10.1364/AO.471270

Applied Optics
Vol. 62,
Issue 3,
pp. 805-812
(2023)
•https://doi.org/10.1364/AO.471270

Combined polishing process of a sapphire aspherical component based on temperature-controlled magnetorheological processing

Ye Tian, Shuo Qiao, Shuangpeng Guo, Yunze Hou, and Feng Shi

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Ye Tian, Shuo Qiao, Shuangpeng Guo, Yunze Hou, and Feng Shi, "Combined polishing process of a sapphire aspherical component based on temperature-controlled magnetorheological processing," Appl. Opt. 62, 805-812 (2023)

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Abstract

In view of the problems of large surface roughness and low removal efficiency caused by the existing sapphire processing process, a combined polishing process based on temperature control computer controlled optical surfacing-magnetic rheology is proposed. The polishing removal mechanism of sapphire material polishing and the law of processing surface roughness change are studied. The optimal process parameters are obtained by designing the orthogonal experiments. Under this parameter, a sapphire aspherical component with good surface quality is obtained, and the temperature has a significant amount of influence on the removal efficiency. Finally, the optimum temperature of sapphire material under magnetorheological polishing was determined to be 75°C. The results greatly improve the manufacturing efficiency of high sapphire surface quality.

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Data availability

Data underlying the results presented in this paper are not publicly available at this time but may be obtained from the authors upon reasonable request.

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	Technological Parameter			Removal Function
No.	pH	Temperature°C	Pressure MPa	Volumetric Efficiency $µ m^{3} / m i n$	Roughness RMS/nm
1	9	30	0.15	0.21	0.575
2	10	30	0.15	0.52	0.573
3	11	30	0.15	1.55	0.597
4	12	30	0.15	2.42	1.846

	Process Parameters			Remove the Function
No.	pH	Temperature°C	Pressure MPa	Volumetric Efficiency $µ m^{3} / m i n$	Roughness, RMS,/nm
1	11	30	0.15	1.55	0.597
2	11	40	0.15	1.82	0.544
3	11	50	0.15	2.25	0.565
4	11	60	0.15	2.46	0.559

	Process Parameters			Remove the Function
No.	pH	Temperature°C	Pressure MPa	Volumetric Efficiency $µ m^{3} / m i n$	Roughness, RMS,/nm
1	11	50	0.15	2.25	0.565
2	11	50	0.20	2.45	0.680
3	11	50	0.25	2.78	0.750
4	11	50	0.30	3.02	0.862

Factor Horizontal	Speed/rpm	Flow Rate/L/min	Field Current/A	Pressure Depth Coefficient $*^{1}$	Temperature/°C
Level 1	220	100	7.0	10%	40
Level 2	220	100	7.0	15%	50
Level 3	220	100	7.0	20%	60

	Process Parameters
No.	Temperature/°C	Pressure Deep Coefficient	Rate of Flow/L/min	Field Current/A	Speed/rpm	Remove the Function Volumetric Efficiency/µm³/min
1	40	0.10	100	7.0	220	1.68 * 106
2	50	0.10	100	7.0	220	2.04 * 106
3	60	0.10	100	7.0	220	2.33 * 106
4	50	0.15	100	7.0	220	2.46 * 106
5	50	0.20	100	7.0	220	2.61 * 106
6	50	0.25	100	7.0	220	3.16 * 106

Abstract

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Equations (4)

Applied Optics