Abstract

Photonics die or integrated photonics modules co-packaged with compute engines have the potential to deliver significant improvements in power, bandwidth and reach needed to meet the computing and communication demands of data centers and other high-performance computing (HPC) systems. The challenges and solutions in co-packaging photonics modules are described through two case studies; one of a network-switch die co-packaged with socketable photonics modules and another of a Field Programmable Gate Array (FPGA) co-packaged with optical dies (tiles). The technical requirements to deliver the promise of co-packaged photonics in high volume are outlined.

Large data centers interconnect bottlenecks

Ali Ghiasi
Opt. Express 23(3) 2085-2090 (2015)

Neuromorphic photonic technologies and architectures: scaling opportunities and performance frontiers [Invited]

George Dabos, Dimitris V. Bellas, Ripalta Stabile, Miltiadis Moralis-Pegios, George Giamougiannis, Apostolos Tsakyridis, Angelina Totovic, Elefterios Lidorikis, and Nikos Pleros
Opt. Mater. Express 12(6) 2343-2367 (2022)

SPRINT: Scalable Photonic Switching Fabric for High-Performance Computing (HPC)

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Polymer waveguides for electro-optical integration in data centers and high-performance computers

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Opt. Express 23(4) 4736-4750 (2015)

Toward higher-radix switches with co-packaged optics for improved network locality in data center and HPC networks [Invited]

Pavlos Maniotis, Laurent Schares, Daniel M. Kuchta, and Bengi Karacali
J. Opt. Commun. Netw. 14(6) C1-C10 (2022)