Abstract
In this talk, the recent achievements in the development and optimization of hybrid multi-layer CMOS-compatible material systems (e.g., SiN/Si, multi-layer Si/SiO2, etc.) to address all the practical requirements of ultra-fast and ultra-compact integrated photonic structures will be discussed. Using these hybrid material systems, a series of ultra-compact and high-performance reconfigurable photonic devices and subsystems that are formed by using high Q resonators will be demonstrated. The use of these devices and subsystems for realization of densely-integrated reconfigurable photonic chips for signal processing and sensing applications will be discussed.
© 2016 Optical Society of America
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