Abstract
In this paper we report the fabrication and operation of a truly integrated optical-electronic device based on a hybrid thin film technology using silicon substrates to perform the electronic functions. This device, which demonstrates acousto-optic deflection, optical waveguiding, and detection on the same chip, represents an initial step in the development of planar signal processing devices which will exploit the advantages of miniaturization of electro-optic devices. In addition, a hybrid thin film approach to fabrication allows the designer to choose the optimum material characteristics for each function.
© 1976 Optical Society of America
PDF ArticleMore Like This
K. A. James, R. R. August, and J. E. Coker
WD11 Conference on Laser and Electrooptical Systems (CLEO:S&I) 1976
C. S. Tsai
WD3 Conference on Laser and Electrooptical Systems (CLEO:S&I) 1976
C. S. Tsai, B. Kim, P. Saunier, and Le T. Nguyen
TuA2 Integrated Optics (IOPT) 1976