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Conferences > 3D > 2023 > DM4A > DM4A.3

T-ray Profile Mapping for Wafer-scale Die Sorting and Yield Improvement

Anis Rahman

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Abstract

Dendrimer dipole excitation-based T-ray source is used with a nanoscanner for profiling dies on a patterned wafer. The proposed sorting criterion via profile mapping improves the yield significantly.

© 2023 The Author(s)

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