Silicon Photonics Integrated Circuit for Co-Packaged Optical-IO

Yuliya Akulova; Saeed Fathololoumi; Kimchau Nguyen; Hari Mahalingam; Pegah Seddighian; Reece Defrees; Reece Defrees; Christian Malouin; Kadhair Al-hemyari; Daniel Zhu; Ling Liao; Thomas Liljeberg

doi:10.1364/CLEOPR.2022.CTuA11D_01

Proceedings of the 2022 Conference on Lasers and Electro-Optics Pacific Rim
Technical Digest Series (Optica Publishing Group, 2022),
paper CTuA11D_01
•https://doi.org/10.1364/CLEOPR.2022.CTuA11D_01

Silicon Photonics Integrated Circuit for Co-Packaged Optical-IO

Yuliya Akulova, Saeed Fathololoumi, Kimchau Nguyen, Hari Mahalingam, Pegah Seddighian, Reece Defrees, Christian Malouin, Kadhair Al-hemyari, Daniel Zhu, Ling Liao, and Thomas Liljeberg

Conference on Lasers and Electro-Optics/Pacific Rim 2022

Sapporo Japan
31 August–5 September 2022
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Silicon Photonics (CTuA11D)

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Y. Akulova, S. Fathololoumi, K. Nguyen, H. Mahalingam, P. Seddighian, R. Defrees, C. Malouin, K. Al-hemyari, D. Zhu, L. Liao, and T. Liljeberg, "Silicon Photonics Integrated Circuit for Co-Packaged Optical-IO," in Proceedings of the 2022 Conference on Lasers and Electro-Optics Pacific Rim, Technical Digest Series (Optica Publishing Group, 2022), paper CTuA11D_01.

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Abstract

Explosive growth of intra-datacenter traffic and scaling of compute fabric drive rapid evolution of the optical I/O architectures. We review advancements in silicon photonics manufacturing platform towards multi-Tb/s optical interconnects.

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