Abstract

In the absence of a truly integrated silicon optoelectronics technology, III-V components are likely to be an indispensable part of optoelectronic integrated systems for the foreseeable future. The development of manufacturable hybridisation technologies for III-V optoelectronic components, compatible with silicon and CMOS substrates, is therefore an essential research topic. In this paper, a review of current and emerging hybridisation technologies for optoelectronic components is presented. Technologies relevant to optoelectronic component hybridisation, including substrate removal, epitaxial lift-off, component alignment techniques, bonding and wiring processes are reviewed. Emerging novel self-assembly technologies, based on molecular tagging and recognition approaches, are also introduced. The state-of-the-art in hybridisation technology is reviewed with reference to recent US and European developments.

© 1998 IEEE