A free-space optoelectronic crossbar interconnect with Terabit/s communication to silicon electronics

SJ Fancey; MG Forbes; MR Taghizadeh; JAB Dines; GS Buller; AC Walker; MPY Desmulliez; MPY Desmulliez; G Pennelli; G Pennelli; JH Marsh; JH Marsh; CR Stanley; CR Stanley; P Horan; P Horan; D Byrne; D Byrne; J Hegarty; J Hegarty; S Eitel; S Eitel; KH Gulden; KH Gulden; A Gauthier; A Gauthier; P Benabes; P Benabes; M Goetz; M Goetz

doi:10.1364/CLEO_EUROPE.1998.CTuC2

Conference on Lasers and Electro-Optics-Europe
Technical Digest Series (Optica Publishing Group, 1998),
paper CTuC2
•https://doi.org/10.1364/CLEO_EUROPE.1998.CTuC2

A free-space optoelectronic crossbar interconnect with Terabit/s communication to silicon electronics

SJ Fancey, MG Forbes, MR Taghizadeh, JAB Dines, GS Buller, AC Walker, MPY Desmulliez, G Pennelli, JH Marsh, CR Stanley, P Horan, D Byrne, J Hegarty, S Eitel, KH Gulden, A Gauthier, P Benabes, and M Goetz

The European Conference on Lasers and Electro-Optics 1998

Glasgow, Scotland United Kingdom
14–18 September 1998
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Optical Interconnects (CTuC)

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S. Fancey, M. Forbes, M. Taghizadeh, J. Dines, G. Buller, A. Walker, M. Desmulliez, G. Pennelli, J. Marsh, C. Stanley, P. Horan, D. Byrne, J. Hegarty, S. Eitel, K. Gulden, A. Gauthier, P. Benabes, and M. Goetz, "A free-space optoelectronic crossbar interconnect with Terabit/s communication to silicon electronics," in Conference on Lasers and Electro-Optics-Europe, Technical Digest Series (Optica Publishing Group, 1998), paper CTuC2.

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Abstract

It has been observed that the fundamental physical limit on communication rates between silicon CMOS chips may be lower than 1 THz for conventional metal lines of lengths - 10cm. This bandwidth limit scales as the aspect ratio (the ratio of total cross-sectional area to length) of the interconnect¹. Since the off-chip bandwidth requirement of silicon ASICs is predicted to increase beyond 1 THz within five years, a potential bottleneck in computational performance can be foreseen. Free space optoelectronic connections show promise in overcoming the predicted bottleneck since they offer high spatial density connections (>10⁶ per cm²) free of the aspect-ratio problem and many other limitations of electrical interconnections².

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