Abstract

Laser-Induced Forward Transfer (LIFT) is an additive and versatile direct-write technique for a single-step pattern- definition and material transfer [1]. In LIFT, a laser pulse is focused through a transparent substrate (the carrier) onto the rear side of a thin film of the material to be printed (the donor) that transfers a donor pixel to another substrate (the receiver) placed in close proximity. In the past, LIFT has been used for printing a wide range of materials for various applications [2]. It offers several advantages such as speed, simplicity and flexibility due to which LIFT is considered to be an excellent tool for rapid prototyping especially for optoelectronic applications. In this paper, we report the first results of LIFT-assisted printing of micro-bumps of non-flux based silver nanoparticle (AgNP) and flux-based solder pastes for flip-chip bonding [3] of optoeletronic components.

© 2013 IEEE