Expand this Topic clickable element to expand a topic
Skip to content
Optica Publishing Group

Analyzing Thermal Tolerance of Mirror-based Optical Redistribution for Co-packaged Optics

Not Accessible

Your library or personal account may give you access

Abstract

The thermal tolerance of mirror-based optical redistribution is analyzed for co-packaged optics. In physical optics propagation analysis, considering thermal deformation, a coupling efficiency of over 0.9 is obtained in the range 0–100 °C.

© 2022 The Author(s)

PDF Article  |   Presentation Video
More Like This
Heat-tolerant 112-Gb/s PAM4 transmission using active optical package substrate for silicon photonics co-packaging

S. Suda, T. Kurosu, A. Noriki, I. Tamai, Y. Ibusuki, A. Ukita, K. Takemura, D. Shimura, Y. Onawa, H. Yaegashi, T. Aoki, and T. Amano
W3C.4 Optoelectronics and Communications Conference (OECC) 2021

Demonstration of Silicon-Photonics Hybrid Glass-Epoxy Substrate for Co-Packaged Optics

A. Noriki, A. Ukita, K. Takemura, S. Suda, T Kurosu, Y. Ibusuki, I. Tamai, D. Shimura, Y. Onawa, H. Yaegashi, and T. Amano
Tu1F.3 European Conference and Exhibition on Optical Communication (ECOC) 2022

Polymer Waveguide-coupled Co-packaged Silicon Photonics-die Embedded Package Substrate

T. Amano, A. Noriki, I. Tamai, Y. Ibusuki, A. Ukita, S. Suda, T. Kurosu, K. Takemura, T. Aoki, D. Shimura, Y. Onawa, and H. Yaegashi
Th4A.1 Optical Fiber Communication Conference (OFC) 2021

Presentation Video

Presentation video access is available to:

  1. Optica Publishing Group subscribers
  2. Technical meeting attendees
  3. Optica members who wish to use one of their free downloads. Please download the article first. After downloading, please refresh this page.

Contact your librarian or system administrator
or
Log in to access Optica Member Subscription or free downloads


More Like This
Heat-tolerant 112-Gb/s PAM4 transmission using active optical package substrate for silicon photonics co-packaging

S. Suda, T. Kurosu, A. Noriki, I. Tamai, Y. Ibusuki, A. Ukita, K. Takemura, D. Shimura, Y. Onawa, H. Yaegashi, T. Aoki, and T. Amano
W3C.4 Optoelectronics and Communications Conference (OECC) 2021

Demonstration of Silicon-Photonics Hybrid Glass-Epoxy Substrate for Co-Packaged Optics

A. Noriki, A. Ukita, K. Takemura, S. Suda, T Kurosu, Y. Ibusuki, I. Tamai, D. Shimura, Y. Onawa, H. Yaegashi, and T. Amano
Tu1F.3 European Conference and Exhibition on Optical Communication (ECOC) 2022

Polymer Waveguide-coupled Co-packaged Silicon Photonics-die Embedded Package Substrate

T. Amano, A. Noriki, I. Tamai, Y. Ibusuki, A. Ukita, S. Suda, T. Kurosu, K. Takemura, T. Aoki, D. Shimura, Y. Onawa, and H. Yaegashi
Th4A.1 Optical Fiber Communication Conference (OFC) 2021

High Power CW Laser for Co-Packaged Optics

Wenjia Zhou, Yan Zhu, Jeff Wang, Michael Moewe, Ruichao Zhu, Wei Zhao, Victor Rossin, Hongyu Liu, Jinsong Wang, Ting Zhu, Prasad Yalamanchili, Thang Pham, Ruby Chen, Vincent Zeng, and James Stewart
SS2D.3 CLEO: Science and Innovations (CLEO:S&I) 2022

2-dimensional Low-profile Fiber Coupler for Co-packaged Optics

Tsutaru Kumagai, Haruki Kitao, and Tetsuya Nakanishi
Tu5.1 European Conference and Exhibition on Optical Communication (ECOC) 2022

Select as filters


Select Topics Cancel
© Copyright 2024 | Optica Publishing Group. All rights reserved, including rights for text and data mining and training of artificial technologies or similar technologies.