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Conferences > ECEOC > 2022 > Tu1F > Tu1F.3
  • European Conference on Optical Communication (ECOC) 2022
  • Technical Digest Series (Optica Publishing Group, 2022),
  • paper Tu1F.3

Demonstration of Silicon-Photonics Hybrid Glass-Epoxy Substrate for Co-Packaged Optics

A. Noriki, A. Ukita, K. Takemura, S. Suda, T Kurosu, Y. Ibusuki, I. Tamai, D. Shimura, Y. Onawa, H. Yaegashi, and T. Amano

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Abstract

To realize a new package substrate for co-packaged optics, silicon-photonics hybrid glass-epoxy substrate with optical redistribution layer was demonstrated. 112 Gbps PAM-4 transmissions through the hybrid substrate were demonstrated with the TDECQ less than 3.4 dB.

© 2022 The Author(s)

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