Abstract

Sandia Laboratories has developed a thin film diamond substrate technology to meet the requirements for high power and high density circuits. Processes were developed to metallize, photopattern, laser process, and, package diamond thin film networks which were later assembled into high power multichip modules (MCMs) to test for effectiveness at removing heat. Diamond clearly demonstrated improvement in heat transfer during 20 Watt, strip heating experiments with junction-to-ambient temperature increases of less than 24°C compared to 126°C and 265°C for the aluminum nitride and ceramic versions, respectively.