Abstract

Not only due to the unique combination of excellent thermal, electrical, and mechanical properties, but also because of the falling prices, diamond is becoming the material of choice for multichip module (MCM) thermal management. Various economic diamond synthesis and post-synthesis processes are needed to be developed, made perfect and scaled up for the market realization of reliable and affordable diamond MCMs. Major efforts in the past few years have led to the newer technologies and resulted into the fabrication of diamond based prototype 2-D and 3-D MCMs. This paper discusses these recent developments useful not only for MCM but also for other thermal management applications.